For the first time, the conference will be co-located with the Fifteenth International Conference on Condition Monitoring and Machine Failure Prevention Technologies (CM 2018/MFPT 2018), which will allow delegates to customise their experience by visiting both events under one roof.
BINDT has always recognised the importance of encouraging students to participate in this major international event. As a repeat to the gesture in 2017, the 57th Annual British Conference on Non-Destructive Testing will be providing generous sponsorship of student registrations in 2018, resulting in a major reduction of fees for student attendance.
There will be three parallel technical sessions covering a broad range of NDT technologies and applications.
A table-top exhibition of NDT- and CM-related products will run alongside CM 2018 and NDT 2018. The exhibition opens on Monday 10 September 2018 from 10h00-16h30 and on Tuesday 11 September 2018 from 10h00-16h30.
Visit us at stand no. 19, represented by Euroteck Systems UK Ltd
Location: Nottingham, UK